Home
About
Contact
Subscribe Us
Disclaimer
Home
Features
_Error Page
Home
PhoneArena
Next year's iPhone 14 could be the first smartphone to use TSMC's new packaging platform
Next year's iPhone 14 could be the first smartphone to use TSMC's new packaging platform
Bitefire
September 24, 2021
Next year's Apple iPhone 14 could be the first phone to use TSMC's new 3DFabric Packaging platform which uses a modular like design and smaller chiplets to take new technologies to market faster.
from PhoneArena https://ift.tt/2Zosn3b
via
IFTTT
Post a Comment
0 Comments
Ads
CATEGORY
Comparison
5
GSMArena.com - Latest articles
4784
Hacker News
149
Mobile
6
PhoneArena
5903
Social Plugin
Popular Posts
Samsung's Galaxy Tab S7 FE is on sale at a record high discount in time for Christmas
December 13, 2021
New top story on Hacker News: Facebook says it will pay news industry $1B over 3 years
February 24, 2021
New York vs LA vs Chicago & more: These are the fastest 5G cities in America
April 06, 2022
Subscribe Us
0 Comments